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Engineering Technician

In United States

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Engineering Technician   

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JOB TITLE:

Engineering Technician

JOB TYPE:

JOB SKILLS:

JOB LOCATION:

Eatontown, NJ United States

JOB DESCRIPTION:

As an Engineering Technician at Client, you will join a highly motivated friendly team of employees focused on developing material solutions for electronics assembly. Client is a rapidly growing company creating many opportunities for career growth.

Client custom designs a complete solution of conductive inks and epoxies as well as novel Anisotropic Conductive Adhesive formulations called ZTACH® ACE.

MINIMUM QUALIFICATIONS:

  • Associate of Science in a technical discipline and 5+ years of relevant experience.
  • Excellent written, verbal, team, interpersonal and communication skills.
  • Be highly proficient in the use of Microsoft Office.
  • Strong attention to detail and quality-oriented decision making.
  • Capability to work effectively with coworkers at every level of the company.
  • Positive, professional, can-do attitude.
  • Ability to work effectively and take initiative with little continuous direct supervision.
  • Effective time management skills to handle tasks in a fast-paced environment.
  • Verify machine set ups and if required assist with the required adjustments
  • Analyze Data to determine areas to focus on for continuous improvement
  • Troubleshoot day to day issues
  • Assist Engineer with developing and testing new processes and materials
  • Assist in training and verification of operators to Standard Operating Procedures
  • Support basic equipment maintenance and repair
  • Willingness to work occasional overtime and weekends as needed to support project execution.

HIGHLY DESIRED EXPERIENCE:

  • Hands-on experience in the development of module packaging processes such as SMT, underfill, dispensing, and epoxy die attach. Experience in advanced packaging technologies such as die attach, wirebond, flip-chip is a plus.
  • Skilled and experienced in Printing Technologies, Surface Mount Technologies and Assembling technologies.
  • Knowledge in Thin Films, Materials Science and Statistical Tools

JOB RESPONSIBILITIES:

  • Help develop new materials
  • Become an expert on all assembly equipment
  • Support the production and engineering team by characterizing material properties.
  • Work with manufacturing to develop new product processes and improve existing.

SPECIFIC RESPONSIBILITIES:

  • Develop dispensing processes to fill and encapsulate electronic devices
  • Using rheology, hardness testing, and other equipment characterize material batches.
  • Use various types of electronics assembly equipment to perform precision attachment of wafer level die, surface mount devices and dispensing equipment on rigid and flexible circuit boards.
  • Work independently to carry out experiments and collect process data
  • Adjust process conditions to optimize the properties of developmental materials
  • Work with the research team to formulate batches of materials to support product development.
  • Keep accurate and detailed laboratory records
  • Process and analyze data and report to team members
  • Assist research and engineering staff with setting up and conducting experiments
  • Work with engineering to develop application specific assembly processes.

Position Details

POSTED:

Nov 27, 2022

EMPLOYMENT:

INDUSTRY:

SNAPRECRUIT ID:

S16558560508915403

LOCATION:

United States

CITY:

Eatontown, NJ

Job Origin:

OORWIN_ORGANIC_FEED

A job sourcing event
In Dallas Fort Worth
Aug 19, 2017 9am-6pm
All job seekers welcome!

Engineering Technician    Apply

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<p>As an Engineering Technician at Client, you will join a highly motivated friendly team of employees focused on developing material solutions for electronics assembly. Client is a rapidly growing company creating many opportunities for career growth.</p> <p>Client custom designs a complete solution of conductive inks and epoxies as well as novel Anisotropic Conductive Adhesive formulations called ZTACH® ACE.</p> <p><strong>MINIMUM QUALIFICATIONS:</strong></p> <ul> <li>Associate of Science in a technical discipline and 5+ years of relevant experience.</li> <li>Excellent written, verbal, team, interpersonal and communication skills.</li> <li>Be highly proficient in the use of Microsoft Office.</li> </ul> <ul type="disc"> <li>Strong attention to detail and quality-oriented decision making.</li> <li>Capability to work effectively with coworkers at every level of the company.</li> <li>Positive, professional, can-do attitude.</li> <li>Ability to work effectively and take initiative with little continuous direct supervision.</li> <li>Effective time management skills to handle tasks in a fast-paced environment.</li> <li>Verify machine set ups and if required assist with the required adjustments</li> <li>Analyze Data to determine areas to focus on for continuous improvement</li> <li>Troubleshoot day to day issues</li> <li>Assist Engineer with developing and testing new processes and materials</li> <li>Assist in training and verification of operators to Standard Operating Procedures</li> <li>Support basic equipment maintenance and repair</li> </ul> <ul> <li>Willingness to work occasional overtime and weekends as needed to support project execution.</li> </ul> <p><strong>HIGHLY DESIRED EXPERIENCE:</strong></p> <ul type="disc"> <li>Hands-on experience in the development of module packaging processes such as SMT, underfill, dispensing, and epoxy die attach. Experience in advanced packaging technologies such as die attach, wirebond, flip-chip is a plus.</li> <li>Skilled and experienced in Printing Technologies, Surface Mount Technologies and Assembling technologies.</li> <li>Knowledge in Thin Films, Materials Science and Statistical Tools</li> </ul> <p><strong>JOB RESPONSIBILITIES:</strong></p> <ul> <li>Help develop new materials</li> <li>Become an expert on all assembly equipment</li> <li>Support the production and engineering team by characterizing material properties.</li> <li>Work with manufacturing to develop new product processes and improve existing.</li> </ul> <p><strong>SPECIFIC RESPONSIBILITIES:</strong></p> <ul type="disc"> <li>Develop dispensing processes to fill and encapsulate electronic devices</li> <li>Using rheology, hardness testing, and other equipment characterize material batches.</li> <li>Use various types of electronics assembly equipment to perform precision attachment of wafer level die, surface mount devices and dispensing equipment on rigid and flexible circuit boards.</li> <li>Work independently to carry out experiments and collect process data</li> <li>Adjust process conditions to optimize the properties of developmental materials</li> <li>Work with the research team to formulate batches of materials to support product development.</li> <li>Keep accurate and detailed laboratory records</li> <li>Process and analyze data and report to team members</li> <li>Assist research and engineering staff with setting up and conducting experiments</li> <li>Work with engineering to develop application specific assembly processes.</li> </ul>


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