Engineering Technician Apply
<p>As an Engineering Technician at Client, you will join a highly motivated friendly team of employees focused on developing material solutions for electronics assembly. Client is a rapidly growing company creating many opportunities for career growth.</p> <p>Client custom designs a complete solution of conductive inks and epoxies as well as novel Anisotropic Conductive Adhesive formulations called ZTACH® ACE.</p> <p><strong>MINIMUM QUALIFICATIONS:</strong></p> <ul> <li>Associate of Science in a technical discipline and 5+ years of relevant experience.</li> <li>Excellent written, verbal, team, interpersonal and communication skills.</li> <li>Be highly proficient in the use of Microsoft Office.</li> </ul> <ul type="disc"> <li>Strong attention to detail and quality-oriented decision making.</li> <li>Capability to work effectively with coworkers at every level of the company.</li> <li>Positive, professional, can-do attitude.</li> <li>Ability to work effectively and take initiative with little continuous direct supervision.</li> <li>Effective time management skills to handle tasks in a fast-paced environment.</li> <li>Verify machine set ups and if required assist with the required adjustments</li> <li>Analyze Data to determine areas to focus on for continuous improvement</li> <li>Troubleshoot day to day issues</li> <li>Assist Engineer with developing and testing new processes and materials</li> <li>Assist in training and verification of operators to Standard Operating Procedures</li> <li>Support basic equipment maintenance and repair</li> </ul> <ul> <li>Willingness to work occasional overtime and weekends as needed to support project execution.</li> </ul> <p><strong>HIGHLY DESIRED EXPERIENCE:</strong></p> <ul type="disc"> <li>Hands-on experience in the development of module packaging processes such as SMT, underfill, dispensing, and epoxy die attach. Experience in advanced packaging technologies such as die attach, wirebond, flip-chip is a plus.</li> <li>Skilled and experienced in Printing Technologies, Surface Mount Technologies and Assembling technologies.</li> <li>Knowledge in Thin Films, Materials Science and Statistical Tools</li> </ul> <p><strong>JOB RESPONSIBILITIES:</strong></p> <ul> <li>Help develop new materials</li> <li>Become an expert on all assembly equipment</li> <li>Support the production and engineering team by characterizing material properties.</li> <li>Work with manufacturing to develop new product processes and improve existing.</li> </ul> <p><strong>SPECIFIC RESPONSIBILITIES:</strong></p> <ul type="disc"> <li>Develop dispensing processes to fill and encapsulate electronic devices</li> <li>Using rheology, hardness testing, and other equipment characterize material batches.</li> <li>Use various types of electronics assembly equipment to perform precision attachment of wafer level die, surface mount devices and dispensing equipment on rigid and flexible circuit boards.</li> <li>Work independently to carry out experiments and collect process data</li> <li>Adjust process conditions to optimize the properties of developmental materials</li> <li>Work with the research team to formulate batches of materials to support product development.</li> <li>Keep accurate and detailed laboratory records</li> <li>Process and analyze data and report to team members</li> <li>Assist research and engineering staff with setting up and conducting experiments</li> <li>Work with engineering to develop application specific assembly processes.</li> </ul>
