• Snapboard
  • Activity
  • Reports
  • Campaign
Welcome ,

Chat with the recruiter

...Minimize

Hey I'm Online! Leave me a message.
Let me know if you have any questions.

Manufacturing Associate

In Texas / United States

Save this job

Manufacturing Associate   

Click on the below icons to share this job to Linkedin, Twitter!

JOB TITLE:

Manufacturing Associate

JOB TYPE:

JOB SKILLS:

JOB LOCATION:

Richardson Texas / United States

JOB DESCRIPTION:

6:45am-7:15pm (Thu, Fri, Sat and every other Wed)

One week will be 36 hours and the following week with be 48 hours with the Saturday included. Must be willing to work any shift. Working shifts 3/4 -4/3 schedule 11.5 hrs a day.


Wafer Fabrication- approximately 6 inches in diameter
FAB- 24 x 7
12.5 hours Work Day

• Working in a clean room environment in a wafer fab.
• Will be on feet and taking care of several responsibilities in different areas within the work cell/tunnel
• Will be processing waffer fabrication in different cells/tunnesl including, but not limited to photolithography, Plasma, Wet-etch, Diffusion, Metal, to testing area.
• Photolithography- coating wafers with Chemical coating to imprint patters, Deposit material on part of the wafer that is not coated multiple times. Takes 4-15 individual step for each wafer.
• Wet Etch- remove things from the wafers that are not needed/intended
• Diffusion- Change molecular structure by inserting into a quarts tube, that is 20 feet long on a “boat” at an extremely high temperature
• Metaling- deposit metal to the wafers to make electronical connection. Will be sawing off the chips
• Testing- will test wafers in the rest area using a vacuum chuck. Tips come down and do the electronical tests



FAB WEAR- provided by client
• Clean room jump suit and hood
• Have shoes to be worn that must remain within the facility
• Safety glasses
• Nose and mouth must be covered
• Gloves




Job Title:Photo- Alignment, Coat, & Bake Operator
Description:
? Setup aligning operation with photo masks.
? Cleans and prepares photo masks for use.
·Use Site and MTI systems to coat and develop silicon wafers with photoresist.
·Operate bake ovens before and after coat.
? Program machines (sets exposure times).
·Program machines and change out chemicals as required.
? Uses measuring tools for qualification of process.
? Inspection of wafers.

Basic Qualifications:
? High School diploma or equivalent.
? Minimum of 1 year of photolithography experience.
Preferred Qualifications:
? Able to read, understand and follow written documents, specs and oral instructions.
? Basic knowledge of Microsoft Windows and Access helpful.
? Must have good hand and eye co-ordination and good wafer handling skills.
? Good communication skills.
? SPC background a plus.
? No chemical restrictions.
? Team oriented.
? Self-directed and accountable for processes and products.

HIGH SCHOOL DIPLOMA/GED REQUIRED. MUST BE VERIFIED THROUGH THE INSTITUTION OR A COPY OF THE CERTIFICATE MUST BE ON FILE

Position Details

POSTED:

May 14, 2022

EMPLOYMENT:

INDUSTRY:

SNAPRECRUIT ID:

S16471296077893

LOCATION:

Texas / United States

CITY:

Richardson

Job Origin:

Jobsrus_organic_feed

A job sourcing event
In Dallas Fort Worth
Aug 19, 2017 9am-6pm
All job seekers welcome!

Manufacturing Associate    Apply

Click on the below icons to share this job to Linkedin, Twitter!

6:45am-7:15pm (Thu, Fri, Sat and every other Wed)

One week will be 36 hours and the following week with be 48 hours with the Saturday included. Must be willing to work any shift. Working shifts 3/4 -4/3 schedule 11.5 hrs a day.


Wafer Fabrication- approximately 6 inches in diameter
FAB- 24 x 7
12.5 hours Work Day

• Working in a clean room environment in a wafer fab.
• Will be on feet and taking care of several responsibilities in different areas within the work cell/tunnel
• Will be processing waffer fabrication in different cells/tunnesl including, but not limited to photolithography, Plasma, Wet-etch, Diffusion, Metal, to testing area.
• Photolithography- coating wafers with Chemical coating to imprint patters, Deposit material on part of the wafer that is not coated multiple times. Takes 4-15 individual step for each wafer.
• Wet Etch- remove things from the wafers that are not needed/intended
• Diffusion- Change molecular structure by inserting into a quarts tube, that is 20 feet long on a “boat” at an extremely high temperature
• Metaling- deposit metal to the wafers to make electronical connection. Will be sawing off the chips
• Testing- will test wafers in the rest area using a vacuum chuck. Tips come down and do the electronical tests



FAB WEAR- provided by client
• Clean room jump suit and hood
• Have shoes to be worn that must remain within the facility
• Safety glasses
• Nose and mouth must be covered
• Gloves




Job Title:Photo- Alignment, Coat, & Bake Operator
Description:
? Setup aligning operation with photo masks.
? Cleans and prepares photo masks for use.
·Use Site and MTI systems to coat and develop silicon wafers with photoresist.
·Operate bake ovens before and after coat.
? Program machines (sets exposure times).
·Program machines and change out chemicals as required.
? Uses measuring tools for qualification of process.
? Inspection of wafers.

Basic Qualifications:
? High School diploma or equivalent.
? Minimum of 1 year of photolithography experience.
Preferred Qualifications:
? Able to read, understand and follow written documents, specs and oral instructions.
? Basic knowledge of Microsoft Windows and Access helpful.
? Must have good hand and eye co-ordination and good wafer handling skills.
? Good communication skills.
? SPC background a plus.
? No chemical restrictions.
? Team oriented.
? Self-directed and accountable for processes and products.

HIGH SCHOOL DIPLOMA/GED REQUIRED. MUST BE VERIFIED THROUGH THE INSTITUTION OR A COPY OF THE CERTIFICATE MUST BE ON FILE


Please wait..!!