Position OverviewAs an Advanced Package Design Engineer, your task is to optimize the design of integrated circuit (IC) packages to enhance performance, reliability, and manufacturability. You will work on high-speed devices with demanding electrical and integration requirements, contributing to advanced 2.5D/3D packaging solutions.ResponsibilitiesPackage Selection and AnalysisSelect appropriate IC package types based on device specifications and system requirements.Analyze electrical, thermal, and mechanical characteristics of the selected package.Identify design limitations, risks, and improvement opportunities early in the development phase.Electrical Performance OptimizationOptimize signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC).Analyze routing, parasitics, impedance control, crosstalk, and noise behavior.Propose and implement design enhancements to improve high-speed performance.Design for Manufacturability and Cost OptimizationEnsure package design compatibility with manufacturing processes and assembly requirements.Review materials, stack-up choices, and routing density for cost and yield optimization.Support efficient production while maintaining performance and reliability targets.Documentation and ReportingPrepare comprehensive technical documentation including simulations, calculations, and design justifications.Clearly communicate analysis results and optimization recommendations to cross-functional teams.Who You AreMSc in the field of electronics & equivalent or at least 2 years of experience in packaging design as well as SIPI analysisKnowledge in Cadence layout toolKnowledge in Ansys toolKnowledge in 2.5D/3D packaging, backend silicon layout (place & route)To be able to communicate in English is a must