Overview Quest Global delivers world-class end-to-end engineering solutions by leveraging our deep industry knowledge and digital expertise. By bringing together technologies and industries, alongside the contributions of diverse individuals and their areas of expertise, we are able to solve problems better, faster. This multi-dimensional approach enables us to solve the most critical and large-scale challenges across the aerospace & defense, automotive, energy, hi-tech, healthcare, medical devices, rail and semiconductor industries. What You Will Do This position involves independently driving the mechanical design of HPC server chassis – the physical frameworks that hold and cool high-end computing systems. The engineer creates 3D models and drawings of the chassis and its components, defines materials and thicknesses, and ensures that all server boards, power supplies, drives, and cooling elements fit together efficiently. The engineer collaborates with thermal experts to design airflow paths, heat sinks, fans, or liquid cooling loops that keep cutting-edge processors and GPUs within safe temperatures. Throughout the design cycle, this engineer will iterate designs based on simulation results and lab testing, balancing performance, cost, and manufacturability. Work Experience What you will bring Proficiency in 3D CAD software for mechanical design using tools like PTC Creo, SolidWorks, or CATIA Strong knowledge of engineering materials (metals, plastics, composites) and their applications in chassis design Familiarity with manufacturing processes is critical Strong analytical thinking to solve complex mechanical and thermal problems. The engineer must be adept at methods like tolerance analysis Excellent communication skills Prior work on HPC Chassis system or data center server hardware is highly valued, as it demonstrates familiarity with the unique challenges of high-power, high-density designs. Good To Have Skills Experience with high-density cooling solutions such as liquid cooling systems (cold plates, pumped liquid loops) or immersion cooling for electronics. Insight into thermal management of GPUs/CPUs (e.g., knowledge of heat flux challenges, two-phase cooling, or facility water-cooling hookups) Background in designing hardware for high-performance computing applications Knowledge of relevant standards and best practices in server and data center design like OCP, knowing ASHRAE TC 9.9 recommended practices for data center equipment thermal envelopes, or compliance with IEC/ISO standards related to electronic equipment. Pay Range $90,000 to $100,000/annum Compensation decisions are made based on factors including experience, skills, education, and other job-related factors, in accordance with our internal pay structure. We also offer a comprehensive benefits package, including health insurance, paid time off, and retirement plan. Benefits 401(k) matching Dental insurance Health insurance Paid time off Vision insurance Employer paid Life Insurance, Short- & Long-Term Disability Work Requirements This role is considered an on-site position located in Houston, TX. You must be able to commute to and from the location with your own transportation arrangements to meet the required working hours. Travel requirements: 0% of travel is required. #J-18808-Ljbffr