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Electro Mechanical Engineer

  • Electro Mechanical Engineer job type Posted on: Oct 20, 2026
  • Electro Mechanical Engineer experience level The Structures Company
  • Electro Mechanical Engineer employment type Orlando, Florida
  • Electro Mechanical Engineer salary Salary: $93 per hour
  • Electro Mechanical Engineer employment type Onsite
  • Electro Mechanical Engineer salary Full-time

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Job Title :

Electro Mechanical Engineer

Job Type :

Full-Time

Job Location :

Orlando Florida United States

Remote :

No

Jobcon Logo Job Description :

JOB TITLE: Electro Mechanical Engineer
LOCATION: Orlando, FL
PAY RATE: $93.94/hour

We are a national aerospace and defense staffing agency seeking highly qualified candidates for a position with a top-tier client.

Job Details:

  • Job Type: Contract (5 months with potential for extension)

  • Clearance: Ability to obtain a security clearance post-start

  • Industry: Aerospace / Defense / Aviation

  • Benefits: Medical, dental, and vision (Cigna)

  • Perks: Bonus potential + Priority access via Tier 1 supplier

  • Openings Nationwide: Thousands of opportunities across the U.S.

Qualifying Questions:

  • Are you a U.S. citizen and able to obtain and maintain a U.S. security clearance?

  • Do you meet the educational and experience requirements for this role?

  • Can you commute to the job location or relocate if necessary?

Summary:

  • Owns package hardware design, heat transfer, thermal dissipation, structural integrity, and mechanical survivability of completed 3DHI packages.

  • Designs multichip package devices including package substrates, Integrated Heat Spreaders, attach mechanisms, stiffeners, and complex thermal management system integration.

  • Develops advanced FEA multiphysics models and simulations for thermal cycling, reliability, power integrity, electrical performance, mechanical stress, shock, and vibration.

  • Defines and executes packaging qualification plans to project requirements, JEDEC standards, and MIL-SPEC standardizations including Highly Accelerated Stress Testing and HAST.

  • Performs failure analysis on critical component interfaces and intermetallic connections including cracked solder joints, delaminated layers, and warped package substrates.

  • Implements corrective actions for identified failure modes in manufacturing and incorporates findings into product revisions and lessons learned.

  • Architects, designs, and validates advanced circuit card packages, high-density circuit cards, cable assemblies, and interconnect solutions.

  • Designs and develops electromechanical systems including printed wiring boards, circuit or electronic card assemblies, harness assemblies, and sub-assemblies.

  • Performs thermal, signal integrity, and electromagnetic compatibility analyses for robust operation in harsh DoD environments.

  • Leads design assurance reviews, tracks issues, drives corrective actions to closure, and manages risk, schedule, and earned value metrics.

Requirements:

  • Ability to obtain a security clearance post-start

  • Must be a U.S. Person (as defined by ITAR).

  • Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university, or minimum 15 years of professional experience in Electromechanical Engineering or a related discipline without a degree.

  • At least 11 years of experience with 3D Heterogeneous Integration (3DHI).

  • At least 11 years of experience with Advanced Packaging.

  • At least 11 years of technical or project leadership experience supporting production of high-reliability electronics products.

  • At least 11 years of experience with microelectronics design.

  • Proficiency in CREO modeling and electromechanical system design.

  • Project leadership or management experience across the engineering and production lifecycle including scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM).

  • Experience working with cross-functional teams across multiple locations.

  • Experience capturing flowed and derived requirements for electromechanical designs.

About Us:

The Structures Company is a premier national aerospace and defense staffing agency specializing in contract, contract-to-hire, and direct hire placements. We deliver expert workforce solutions across engineering, IT, production, maintenance, and support roles.

As trusted partners to leading aerospace and defense OEMs and Tier 1 suppliers, we connect professionals with career opportunities to grow and excel in aviation, aerospace, and defense.

Eligibility Requirements:

Must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual under 8 U.S.C. 1324b(a)(3)) to comply with ITAR regulations.

Keywords: aerospace, aviation, engineering, maintenance, aircraft design, defense

Take your career to new heights-apply today!

Engineers - #jobad

Jobcon Logo Position Details

Posted:

Oct 20, 2026

Reference Number:

17795-11534

Employment:

Full-time

Salary:

$93 per hour

City:

Orlando

Job Origin:

CIEPAL_ORGANIC_FEED

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JOB TITLE: Electro Mechanical Engineer
LOCATION: Orlando, FL
PAY RATE: $93.94/hour

We are a national aerospace and defense staffing agency seeking highly qualified candidates for a position with a top-tier client.

Job Details:

  • Job Type: Contract (5 months with potential for extension)

  • Clearance: Ability to obtain a security clearance post-start

  • Industry: Aerospace / Defense / Aviation

  • Benefits: Medical, dental, and vision (Cigna)

  • Perks: Bonus potential + Priority access via Tier 1 supplier

  • Openings Nationwide: Thousands of opportunities across the U.S.

Qualifying Questions:

  • Are you a U.S. citizen and able to obtain and maintain a U.S. security clearance?

  • Do you meet the educational and experience requirements for this role?

  • Can you commute to the job location or relocate if necessary?

Summary:

  • Owns package hardware design, heat transfer, thermal dissipation, structural integrity, and mechanical survivability of completed 3DHI packages.

  • Designs multichip package devices including package substrates, Integrated Heat Spreaders, attach mechanisms, stiffeners, and complex thermal management system integration.

  • Develops advanced FEA multiphysics models and simulations for thermal cycling, reliability, power integrity, electrical performance, mechanical stress, shock, and vibration.

  • Defines and executes packaging qualification plans to project requirements, JEDEC standards, and MIL-SPEC standardizations including Highly Accelerated Stress Testing and HAST.

  • Performs failure analysis on critical component interfaces and intermetallic connections including cracked solder joints, delaminated layers, and warped package substrates.

  • Implements corrective actions for identified failure modes in manufacturing and incorporates findings into product revisions and lessons learned.

  • Architects, designs, and validates advanced circuit card packages, high-density circuit cards, cable assemblies, and interconnect solutions.

  • Designs and develops electromechanical systems including printed wiring boards, circuit or electronic card assemblies, harness assemblies, and sub-assemblies.

  • Performs thermal, signal integrity, and electromagnetic compatibility analyses for robust operation in harsh DoD environments.

  • Leads design assurance reviews, tracks issues, drives corrective actions to closure, and manages risk, schedule, and earned value metrics.

Requirements:

  • Ability to obtain a security clearance post-start

  • Must be a U.S. Person (as defined by ITAR).

  • Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university, or minimum 15 years of professional experience in Electromechanical Engineering or a related discipline without a degree.

  • At least 11 years of experience with 3D Heterogeneous Integration (3DHI).

  • At least 11 years of experience with Advanced Packaging.

  • At least 11 years of technical or project leadership experience supporting production of high-reliability electronics products.

  • At least 11 years of experience with microelectronics design.

  • Proficiency in CREO modeling and electromechanical system design.

  • Project leadership or management experience across the engineering and production lifecycle including scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM).

  • Experience working with cross-functional teams across multiple locations.

  • Experience capturing flowed and derived requirements for electromechanical designs.

About Us:

The Structures Company is a premier national aerospace and defense staffing agency specializing in contract, contract-to-hire, and direct hire placements. We deliver expert workforce solutions across engineering, IT, production, maintenance, and support roles.

As trusted partners to leading aerospace and defense OEMs and Tier 1 suppliers, we connect professionals with career opportunities to grow and excel in aviation, aerospace, and defense.

Eligibility Requirements:

Must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual under 8 U.S.C. 1324b(a)(3)) to comply with ITAR regulations.

Keywords: aerospace, aviation, engineering, maintenance, aircraft design, defense

Take your career to new heights-apply today!

Engineers - #jobad

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