We are seeking an experienced Electronics Packaging Design Engineer to join our team. In this role, you will lead the design of advanced packaging solutions including flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures. You'll collaborate with cross-functional teams and suppliers to deliver reliable, manufacturable, and cost-effective designs.

Responsibilities:

• Design interconnects, substrate stack-ups, routing strategies, and package layouts.
• Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
• Partner with suppliers and internal teams to align designs with process capabilities.
• Support failure analysis and root-cause investigations.
• Document design processes and lead reviews from concept to release.
• Mentor junior engineers and support packaging technology roadmaps.

Qualifications

• Bachelor's in Electrical Engineering, Materials Science, or related field.
• 8+ years in IC/electronic packaging design.
• Proficiency with Cadence Allegro or equivalent tools.
• Expertise in advanced packaging (2.5D/3D, interposers, HBM, fan-out WLP, wire bond, flip chip, stacked die, ceramic co-fire, encapsulated modules/BGAs).
• Strong knowledge of substrate technologies and manufacturing processes.
• Excellent problem-solving and communication skills.

Preferred: Experience with OSATs/foundries, high-speed digital interfaces (PCIe, DDR, SerDes), package-level simulation tools, and defense packaging for extreme environments.

Why is This a Great Opportunity

Well-established, stable company. Long-term projects featuring great technology. They are a great team of people to work with.