Module Process Engineer IV - (E4) – Plasma Etch

Salary: $116,000.00 - $159,500.00 Location: Boise, ID Key Responsibilities Lead technical discussions with customers to understand High Value Problems (HVPs) and define, propose, and implement Continuous Improvement Projects (CIPs). Capture and institutionalize learnings to maximize service opportunities and deliver measurable improvements to customer KPIs. Increase Customer Service Agreement (CSA) value through defect reduction, variability reduction, cost‑of‑ownership (COO) improvement, preventive maintenance optimization, process Cpk improvement, tool matching, and output optimization. Identify and drive opportunities for CSA renewal, upsell, and penetration. Demonstrate and lead adoption of new service technologies, including FabVantage offerings, through customer demos, on‑site evaluations, and Joint Development Programs (JDPs). Resolve complex equipment and process issues using advanced analytics, equipment and process expertise, and systematic troubleshooting methodologies to perform effective root cause diagnosis. Generate comprehensive technical reports and present findings to customers, including prioritization and recommendations based on analysis of Bill of Materials (BOM), Equipment Constants (EC), tool sensor data, on‑wafer results, and benchmarking across products. Serve as a technical authority in plasma etch, providing guidance on integration, yield, and manufacturability challenges. Mentor and lead junior‑level MPEs, providing technical direction, coaching, and knowledge transfer. Functional & Technical Knowledge Recognized technical expert with deep process engineering experience in plasma etch technologies and strong Wafer Fab background. In‑depth knowledge of hardware and processes across one or more plasma etch areas; experience with two or more technologies strongly preferred. Domain knowledge of four or more processes spanning two or more technologies. Must have strong data analytics capability to analyze complex process, yield, and equipment issues. Broad understanding of adjacent disciplines with advanced integration knowledge considered a strong plus. Business & Leadership Competencies Interprets internal and external business challenges and recommends best practices to improve products, processes, and services. Leads functional teams or projects with moderate complexity, risk, and resource requirements. Drives complex problem solving using advanced analytical judgment and innovative solution development. Impacts customer, operational, project, and service objectives while operating within established functional policies. Communicates complex technical concepts clearly and effectively; negotiates and influences stakeholders, often at senior levels, to adopt new approaches or solutions. Qualifications BS in Engineering, Physics, or Chemistry (or equivalent). 7+ years of experience in plasma etch process engineering. Strong Wafer Fab and semiconductor equipment experience. Proven technical expertise in plasma etch unit processes and Wafer Fab operations. Demonstrated ability to communicate complex ideas, anticipate objections, and persuade senior stakeholders. Ability to travel domestically as assigned Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 25% of the Time Relocation Eligible: Yes Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. #J-18808-Ljbffr