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Package Development Engineer

  • Package Development Engineer job type Posted on: Nov 01, 2026
  • Package Development Engineer experience level Compri Consulting
  • Package Development Engineer employment type Scottsdale, Arizona
  • Package Development Engineer employment type Onsite
  • Package Development Engineer salary Full-time
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Job Title :

Package Development Engineer

Job Type :

Full-Time

Job Location :

Scottsdale Arizona United States

Remote :

No

Jobcon Logo Job Description :

View Full Description
Compri Consulting is seeking a Package Development Engineer for a direct hire, onsite position in San Jose, CA or Scottsdale, AZ.Relocation Assistance AvailableLead the development and commercialization of advanced embedded packaging technologies, including embedded passives, active devices, and high-density substrates. Drive package architecture, process development, reliability qualification, and manufacturing readiness while partnering with internal teams and external suppliers.Key ResponsibilitiesDevelop embedded package architectures and define substrate stack-ups, interconnects, and thermal solutionsLead process development, qualification, and reliability assessments (JEDEC/IPC)QualificationsBS/MS in Engineering (Electrical, Mechanical, Materials, or related) 8+ years semiconductor packaging experienceExpertise in embedded packaging, substrates, reliability, and process optimization (DOE, SPC)

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Package Development Engineer (San Jose, CA)

Confidential Employer
Scottsdale, Arizona

Jobcon Logo Position Details

Posted:

Nov 01, 2026

Reference Number:

10440_4483222895

Employment:

Full-time

City:

Scottsdale

Job Origin:

APPCAST_CPC

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Compri Consulting is seeking a Package Development Engineer for a direct hire, onsite position in San Jose, CA or Scottsdale, AZ.Relocation Assistance AvailableLead the development and commercialization of advanced embedded packaging technologies, including embedded passives, active devices, and high-density substrates. Drive package architecture, process development, reliability qualification, and manufacturing readiness while partnering with internal teams and external suppliers.Key ResponsibilitiesDevelop embedded package architectures and define substrate stack-ups, interconnects, and thermal solutionsLead process development, qualification, and reliability assessments (JEDEC/IPC)QualificationsBS/MS in Engineering (Electrical, Mechanical, Materials, or related) 8+ years semiconductor packaging experienceExpertise in embedded packaging, substrates, reliability, and process optimization (DOE, SPC)

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