This position holds a role of CAE engineer for eHW team, perform FE analysis to support mechanical design, failure analysis and reliability analysis. Candidates should have experiences in FE analysis including static and dynamic structure analysis, thermal stress analysis. Key Accountabilities Necessary geometry pre-process, meshing and material property assignment ability, etc. Create FE model, define constraints, loads, connections, etc. Analysis Type: static structure analysis (interference, seal), dynamic analysis (modal, random and harmonic analysis, mechanical shock), fatigue evaluation, thermal stress analysis (CTE), multi-physics field coupling analysis (structure, thermal, CFD, electric). Post-processing and reports, provide reliable conclusion and suggestions. Key Competencies Major in mechanical or automotive related. Practical experience in new energy vehicle/ semiconductor packaging projects, familiar with mechanical design/semiconductor packaging. Master’s degree 2-3 years of experience or bachelor’s degree 5-8 years of experience in FEA. Static and dynamic structure analysis is a must, CFD and thermal analysis is a plus In-depth understanding of physical problems, material constitutive model, structure behavior. Proficient in office software and oral & written English. Software skills: Hypermesh, Ansys and NX. Conduct simulation according to project schedule and coordinate work with mechanical engineer for supporting product design. #J-18808-Ljbffr