Senior Module Engineer

Location: Santa Barbara, CA

Fulltime, Direct Hire, Relocation assistant

Role Overview: Senior Module Engineer

As a Senior Module Engineer, you will play a lead role in the development of an integrated hardware platform by spearheading transceiver module development and commercialization activities. In this role, you will collaborate closely with the photonic integrated circuit (PIC) development team, systems team, and test and characterization team to drive the organization s core technology into final module products.

Key Responsibilities:

• Define hardware architectures for next-generation optical transceiver modules.
• Translate system requirements into optical, electrical, and mechanical design specifications.
• Ensure the integrated module is designed for reliability, manufacturability, and cost-effectiveness.
• Collaborate with the PIC team to ensure optical engine compatibility with module designs.
• Optimize optical coupling (attach, lensing, tolerances) for performance and manufacturability.
• Oversee high-speed PCB design, signal integrity, and power integrity for PAM4/coherent lanes.
• Guide DSP/driver/AFE integration and testing processes.
• Perform thermal modeling, heatsink design, and develop module reliability strategies for high-power pluggables.
• Work with the test team to establish test plans for module characterization (optical eye, TDECQ, jitter, sensitivity, power consumption).
• Lead system-level validation in customer-like environments (switch/router/AI cluster testbeds).
• Manage early prototypes, including hands-on assembly, debugging, and troubleshooting.
• Engage with optics, IC, and packaging vendors to qualify components and negotiate specifications.
• Define DFM/DFT strategies, including optical/electrical test procedures, assembly tolerances, and burn-in processes.
• Ensure modules comply with MSAs, IEEE/ITU standards, and Telcordia reliability requirements.
• Support technical discussions with customers and partners, providing performance data and roadmap alignment.

Required Qualifications and Skills:

• M.S. or Ph.D. in Electrical Engineering, Physics, Optics, or a related field.
• 5+ years of experience in optical module or hardware development.
• High-Speed Electronics: Experience with PAM4 and/or coherent links, SerDes, TIAs, drivers, and DSPs.
• Signal Integrity & RF: Expertise in eye diagrams, jitter analysis, TDECQ, crosstalk, and channel modeling.
• Packaging & Assembly: Experience with fiber attach, lens alignment, hermetic/non-hermetic packaging, PCB layout, and co-packaged optics.
• Experience in thermal modeling, heatsink design, and reliability testing under high power density.
• Strong understanding of industry standards such as IEEE 802.3, OIF, and MSAs (QSFP, OSFP, COBO, LPO/CPO).
• Proficiency in test and characterization tools such as BERTs, high-speed oscilloscopes, optical spectrum analyzers, and automated test platforms.
• Familiarity with simulation and modeling tools like Lumerical, Zemax, HFSS, ADS, COMSOL, or equivalent.
• Experience with DFM/DFT processes, Telcordia GR-468 compliance, accelerated lifetime testing, and yield optimization.
• Excellent teamwork, collaboration, and communication skills.