Role: Senior/Principal Engineer with Signal/Power Integrity, Multiphysics, PDK/ADK Experience

Location: Austin, TX (HYBRID)

Job Type: FULL TIME

MUST HAVE: SI/PI - Signal Integrity /Power Integrity, Multiphysics simulations, Advanced packaging, Heterogeneous integration platforms, multi-material packages, PDK/ADK simulation collateral Experience

Job Description:

What You'll Do

• Own and execute hands-on SI/PI and multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
• Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
• Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
• Run end-to-end simulation workflows including EM extraction, S-parameter generation, PDN impedance analysis, crosstalk/eye diagram simulations, thermal/structural reliability checks, and co-simulation across domains.
• Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
• Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
• Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
• Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.

Required Qualifications:

• BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
• 8+ years (Senior) / 12+ years (Principal) of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
• Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
• Proven ability to extract/package-level models (RLC, S-parameters, dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
• Demonstrated experience creating and validating PDK/ADK simulation collateral spanning SI/PI, RF, thermal, and mechanical domains.
• Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
• Startup DNA. You're energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
• Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
• Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30 50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

Preferred Qualifications:

• MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
• Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
• Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.
• Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
• Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
• Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.