Sr. 3D Packaging & Systems Integration Engineer Apply
A leading semiconductor foundry is seeking a New Graduate College candidate for a 3-year contract to support 3D packaging research and system co-optimization. The role involves learning integration steps, managing joint projects with IMEC, and contributing to scientific publications. Candidates should hold a technology-related degree (PhD preferred) and have strong interpersonal and problem-solving skills. The position is based in Malta, NY, USA after an initial assignment in Leuven, Belgium. #J-18808-Ljbffr

