<p> <strong>Summary: </strong> </p><p>We are seeking a knowledgeable, self-motivated individual for our growing operations team which will support processing in a dynamic production and R&D environment. This position will focus on supporting advanced packaging processing and process development, for, but not limited to, silicon interposer fabrication, through silicon via (TSV) fabrication, wafer bumping and micro-bumping, package assembly, and integrating a