Materials Scientist / Process Development Engineer – Advanced Semiconductor Packaging

Location: Remote (U.S.)Employment Type: Full-timeBase Salary: 140,000–180,000 + Equity + BonusTravel: 50%+ International TravelAbout the Role:We are seeking a Materials Scientist / Process Development Engineer to advance innovative materials and processes for next-generation semiconductor packaging and heterogeneous integration. This role focuses on dielectric materials, polymers, surface chemistry, and interface engineering to address critical thermal-management challenges in AI infrastructure and advanced computing.You will take ownership of materials research, process development, experimental validation, and technical problem-solving within an early-stage technology environment, helping advance emerging technology from research through proof of concept.Key Responsibilities:Develop and evaluate dielectric and polymer materials for advanced semiconductor packaging.Investigate surface chemistry, interface engineering, adhesion, material compatibility, and bond-void formation.Develop and optimize semiconductor processes, including plasma activation, ALD, CVD, PVD, CMP, electroplating, and wafer bonding.Perform materials characterization, failure analysis, and root-cause investigations involving delamination, cracking, oxidation, corrosion, and interfacial defects.Design experiments using Design of Experiments (DOE) and apply Statistical Process Control (SPC) to optimize process performance.Establish process windows, validate experimental results, and communicate technical findings and recommendations.Collaborate with engineering teams, research institutions, materials suppliers, and international technical partners.Independently investigate complex technical challenges and drive solutions from initial analysis through experimental validation.Qualifications:MS or PhD in Materials Science and Engineering, Chemistry, Chemical Engineering, or a related technical field.Strong expertise in materials science applied to semiconductor processing or advanced packaging.Working knowledge of dielectric materials, polymers, surface chemistry, and material interfaces.Demonstrated ability to independently solve complex technical problems through experimentation and validation.Strong analytical, experimental design, root-cause analysis, and problem-solving skills.Typically 3–8 years of relevant industry or research experience.Existing U.S. work authorization; visa sponsorship is not available.Willingness to undertake 50%+ international travel, including potential extended stays of up to three months during the first year.Preferred Qualifications:Experience with hybrid bonding, chiplet integration, wafer-level packaging, 3D IC, TSVs, fan-out packaging, or HBM.Familiarity with characterization techniques such as XPS, ToF-SIMS, TEM, AFM, FTIR, Raman spectroscopy, XRD, and ellipsometry.Experience with analytical or simulation tools such as JMP, Minitab, Python, MATLAB, or COMSOL.Background in semiconductor manufacturing, electronic materials, semiconductor equipment, or university and national laboratory research.Why Consider This Opportunity?Technical Ownership: Lead materials investigations and influence process development in an evolving technology environment.Advanced Technology: Contribute to semiconductor packaging innovations supporting AI infrastructure and advanced computing.Research & Development: Work on complex materials challenges and help move emerging technologies toward proof of concept.Collaborative Environment: Engage with engineering teams, research institutions, and international technical partners.Interview Process:The interview process includes three video interviews:Initial discussion with the Head of Engineering or a team member.Technical presentation on an advanced semiconductor packaging topic.Detailed discussion of a technical problem independently solved by the candidate. PhD candidates may present their dissertation research as an example.Candidates with strong materials-science expertise, hands-on experimental experience, and a passion for solving complex semiconductor challenges are encouraged to apply.